High electrical conductivity of P type a-SiGe:H films deposited by PECVD

Ernesto Francoq, A. Torres
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引用次数: 1

Abstract

Highly doped films P type a-SiGe:H and undoped a-SiGe:H films with different germanium content were studied by electrical and morphology characterization for increase their electrical conductivity value (maximum value found: 6.1 × 10−2 Ω−1cm−1). The samples were deposited by low frequency (LF) PECVD at 200°C, 1.2 Torr of pressure at RF frequency of 110 kHz. Boron was used as dopant in the range from 0.26 % to 4% in steps of 0.26% approximately. The most conductivity films were obtained at 4% boron in gas phase, this characteristic made the material attractive for development of TFTs as source and drain regions. Additionally, the p type material allows the possibility of producing the CMOS technology in the TFTs technology, also it may be deposited in flexible substrates and used in solar cell as emitter. On the other hand the a-Ge is used for passivating the surface of high-purity Ge detectors.
PECVD沉积P型a-SiGe:H薄膜的高导电性
对高掺杂P型a-SiGe:H薄膜和未掺杂不同锗含量的a-SiGe:H薄膜进行电学和形貌表征,发现其电导率最大值为6.1 × 10−2 Ω−1cm−1。样品采用低频(LF) PECVD沉积,温度为200℃,压力为1.2 Torr,射频频率为110 kHz。硼作为掺杂剂在0.26% ~ 4%范围内,以0.26%左右为步长。在气相中硼含量为4%时,薄膜的电导率最高,这一特性使得该材料具有作为源区和漏区开发tft的吸引力。此外,p型材料允许在TFTs技术中生产CMOS技术的可能性,也可以沉积在柔性衬底上并用作太阳能电池的发射极。另一方面,a-Ge用于高纯度锗探测器表面的钝化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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