Placement of substrate contacts to alleviate substrate noise in epi and non-epi technologies

Abstract

The placement of substrate contacts in epi and non-epi technologies in order to control and reduce the substrate noise amplitude and spreading is analyzed. The choice of small or large substrate contacts or rings for each of the two major technologies are highlighted. Design guidelines for placing substrate contacts particularly appropriate to improving the noise immunity of digital circuits in mixed-signal smart-power systems are also presented.