Modeling and simulation of phonon boundary scattering in PDE-based device simulators

O. Tornblad, P. Sverdrup, D. Yergeau, Zhiping Yu, Kenneth E. Goodson, Robert W. Dutton
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引用次数: 8

Abstract

In this work, the effect of phonon boundary scattering on the heat transfer in thin silicon layers and close to interfaces was investigated. The modeling is applicable to silicon-on-insulator (SOI) devices as well as to conventional bulk technology. From a linearized Boltzmann transport equation (BTE), anisotropic local thermal conductivities are derived. A separate expression is formulated for the case of a bulk device where only one interface is present. Anisotropy was implemented as a finite element-based operator into the PROPHET device simulator and a demonstration of the new electrothermal modeling was made for a conventional MOSFET. The anisotropic local thermal conductivities lead to a temperature increase /spl sim/30% higher at the gate oxide interface compared to conventional modeling.
基于pde的器件模拟器中声子边界散射的建模与仿真
本文研究了声子边界散射对薄硅层和界面附近传热的影响。该模型既适用于传统的体块工艺,也适用于绝缘体上硅(SOI)器件。从线性化的玻尔兹曼输运方程(BTE)中,导出了各向异性的局部热导率。对于只存在一个接口的批量设备,制定了一个单独的表达式。将各向异性作为基于有限元的运算符实现到PROPHET器件模拟器中,并对传统MOSFET进行了新的电热建模演示。与传统模型相比,各向异性的局部热导率导致栅极氧化物界面的温度升高/spl sim/30%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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