O. Tornblad, P. Sverdrup, D. Yergeau, Zhiping Yu, Kenneth E. Goodson, Robert W. Dutton
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引用次数: 8
Abstract
In this work, the effect of phonon boundary scattering on the heat transfer in thin silicon layers and close to interfaces was investigated. The modeling is applicable to silicon-on-insulator (SOI) devices as well as to conventional bulk technology. From a linearized Boltzmann transport equation (BTE), anisotropic local thermal conductivities are derived. A separate expression is formulated for the case of a bulk device where only one interface is present. Anisotropy was implemented as a finite element-based operator into the PROPHET device simulator and a demonstration of the new electrothermal modeling was made for a conventional MOSFET. The anisotropic local thermal conductivities lead to a temperature increase /spl sim/30% higher at the gate oxide interface compared to conventional modeling.