High-Throughput, Multi-Function, On-Wafer Test System

G. Lewis, R. Sweeney, P. Lorch, R. McAleenan, Gary Hewitt, Tim Semones
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引用次数: 1

Abstract

analyzing and solving numerous hardware and software test issues, and it requires a thorough knowledge of the entire test environment. The most effective way to address the variety of issues is to create a partnership between several companies (hardware and software vendors and end users). In this spirit, ITT, HP, IMS and Cascade are working together to create an on-wafer RF test environment which addresses high throughput, low cost military test needs. HP is chartered with developing the test system hardware, Cascaded is chartered with developing the test executive software (test plan editor, probe plan editor, display utilities, etc.), IMS is chartered with developing the software measurement modules (S Parameters, NF, PldB, etc.), and ITT will integrate and evaluate the entire system. The objective of our efforts is to create a software reconfigureable, high throughput, on-wafer test system that can characterize all MMICs (including power amplifier ICs) at the lowest possible per unit test cost.
高通量,多功能,晶圆上测试系统
分析和解决大量的硬件和软件测试问题,这需要对整个测试环境有全面的了解。解决各种问题的最有效方法是在几个公司(硬件和软件供应商以及最终用户)之间建立伙伴关系。本着这种精神,ITT、惠普、IMS和Cascade正在共同努力创建一个晶圆上射频测试环境,以满足高吞吐量、低成本的军事测试需求。HP被授权开发测试系统硬件,cascade被授权开发测试执行软件(测试计划编辑器、探针计划编辑器、显示工具等),IMS被授权开发软件测量模块(S Parameters、NF、PldB等),ITT将集成和评估整个系统。我们努力的目标是创建一个软件可重新配置,高吞吐量的晶圆上测试系统,可以以最低的单位测试成本表征所有mmic(包括功率放大器ic)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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