Generic Modeling of Via-Stripline Structures in Multi-Layer Board for High Speed Applications

Abstract

To accelerate the simulation timing for more general structures like a stripline connected between vias, generic models were developed for a differential strip line connecting differential pair of vias. While a less time consuming 2-dimensional (2D) simulations are used for striplines, an analytical approximation has been employed for vias. The models developed have shown close correlation (within+/-1.5 dB) with that of 3D full wave simulation models with frequency ranges of 10 MHz to 20 GHz.