{"title":"Reliability test chips: NIST 33 and NIST 34 for JEDEC inter-laboratory experiments and more","authors":"H. Schafft","doi":"10.1109/IRWS.1997.660312","DOIUrl":null,"url":null,"abstract":"Two reliability test patterns, NIST 33 and NIST 34, are being designed, and a third, NIST 36, is being planned to be used in a number of inter-laboratory experiments as part of the activities of the Metal Reliability Task Group of the EIA/JEDEC Committee JC 14.2 on Wafer Level Reliability. These chips will also be used for other tasks, many of which will provide additional characterization data in support of the JEDEC inter-laboratory experiments.","PeriodicalId":193522,"journal":{"name":"1997 IEEE International Integrated Reliability Workshop Final Report (Cat. No.97TH8319)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 IEEE International Integrated Reliability Workshop Final Report (Cat. No.97TH8319)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRWS.1997.660312","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Two reliability test patterns, NIST 33 and NIST 34, are being designed, and a third, NIST 36, is being planned to be used in a number of inter-laboratory experiments as part of the activities of the Metal Reliability Task Group of the EIA/JEDEC Committee JC 14.2 on Wafer Level Reliability. These chips will also be used for other tasks, many of which will provide additional characterization data in support of the JEDEC inter-laboratory experiments.