Classic and alternative methods of p-type doping 4H-SiC for integrated lateral devices

M. Lazar, D. Carole, C. Raynaud, G. Ferro, S. Sejil, F. Laariedh, C. Brylinski, D. Planson, H. Morel
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引用次数: 4

Abstract

P-type 4H-SiC layers formed by ion implantation need high temperature process generating surface roughness, losing and incomplete activation of dopants. Due to dopant redistribution and channeling effect, it is difficult to predict the depth of the formed junctions. Vapor-Liquid-Solid (VLS) selective epitaxy is an alternative method to obtain locally highly doped p-type layers in the 1020 cm-3 range or more. The depth of this p-type layers or regions is accurately controlled by the initial Reactive-Ion-Etching (RIE) of the SiC. Lateral Junction Field Effect Transistor (JFET) devices are fabricated integrating p-type layers created by Al ion implantation or VLS growth. The P-type VLS layers improve the access resistances on the electrodes of the fabricated devices.
集成横向器件中p型掺杂4H-SiC的经典和替代方法
离子注入形成的p型4H-SiC层需要高温过程,产生表面粗糙度,掺杂剂损失和不完全活化。由于掺杂物的再分布和沟道效应,形成结的深度难以预测。蒸汽-液-固(VLS)选择性外延是获得1020 cm-3或更大范围内局部高掺杂p型层的另一种方法。这种p型层或区域的深度由碳化硅的初始反应离子蚀刻(RIE)精确控制。横向结场效应晶体管(JFET)器件是由Al离子注入或VLS生长形成的p型层集成而成的。p型VLS层提高了所制器件电极上的接入电阻。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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