A 16 Mb mask ROM with programmable redundancy

Y. Naruke, T. Iwase, M. Takizawa, K. Saito, M. Asano, H. Nishimura, T. Mochizuki
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引用次数: 13

Abstract

In response to demands for a mask ROM with large bit capacity, a 1M-word*16 bit mask ROM with 120-ns access time has been fabricated. A programmable redundancy technique utilizes electrically fusible polysilicon links with the secondary breakdown mechanism of a MOSFET for high production yield and small chip area. The memory cell matrix arranged in 8192 rows*2048 columns and is divided into four blocks by two sets of row decoders in order to reduce word line delay. The redundancy cell array is composed of 8 rows*256 columns which can replace four defective quarter-rows. The mask ROM is fabricated in single-polysilicon single-aluminium twin-well CMOS technology with 0.7- mu m photolithography for high bit density. The process parameters and design features of the mask ROM are given together with a block diagram.<>
具有可编程冗余的16mb掩码ROM
为了满足对大容量掩码ROM的需求,制作了一个访问时间为120ns的1m字*16位掩码ROM。一种可编程冗余技术利用电熔多晶硅链路和MOSFET的二次击穿机制来实现高产量和小芯片面积。存储单元矩阵按8192行*2048列排列,由两组行解码器分成四个块,以减少字行延迟。冗余单元阵列由8行*256列组成,可以代替4个有缺陷的四分之一行。掩模ROM采用单多晶硅单铝双孔CMOS技术制造,采用0.7 μ m光刻技术实现高比特密度。给出了掩模ROM的工艺参数和设计特点,并给出了框图。
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