{"title":"Highlights of the 2002 national electronic manufacturing technology roadmaps and their applicability to China","authors":"R. Pfahl","doi":"10.1109/EPTC.2003.1298687","DOIUrl":null,"url":null,"abstract":"This presentation describes the roadmapping process used in North America, highlights key global results of the 2002 edition, and suggests how this roadmap and the roadmap process might benefit the electronics industry in China. The 2002 national electronic manufacturing technology roadmap (NEMI, 2002) was released by NEMI on April 1, 2003. This edition of the biennial roadmap is over 1000 pages long and was produced by over 350 individuals from over 170 industrial, government, and academic institutions in North America in cooperation with SIA (Semiconductor Industry Association), IRC, IMAPS (International Microelectronics and Packaging Society), USDC (United States Display Consortium), NSIC (National Storage Industry Consortium), and OIDA (Optoelectronics Industry Development Association). It contains eighteen individual technology roadmaps covering all aspects of the global electronics industry and its supply chain.","PeriodicalId":201404,"journal":{"name":"Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.","volume":"2012 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2003.1298687","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This presentation describes the roadmapping process used in North America, highlights key global results of the 2002 edition, and suggests how this roadmap and the roadmap process might benefit the electronics industry in China. The 2002 national electronic manufacturing technology roadmap (NEMI, 2002) was released by NEMI on April 1, 2003. This edition of the biennial roadmap is over 1000 pages long and was produced by over 350 individuals from over 170 industrial, government, and academic institutions in North America in cooperation with SIA (Semiconductor Industry Association), IRC, IMAPS (International Microelectronics and Packaging Society), USDC (United States Display Consortium), NSIC (National Storage Industry Consortium), and OIDA (Optoelectronics Industry Development Association). It contains eighteen individual technology roadmaps covering all aspects of the global electronics industry and its supply chain.