Scalable benchtop test system applying IEEE-P1693 MIPSS standard

Abstract

This paper discusses Modular Integration Packaging for Scalable System (MIPSS) being developed under a preliminary standard IEEE-P1693 and describes a benchtop application of the new architecture design. The building block approach segments a test system into core and augmented elements as illustrated in Figure 1. MIPSS defines the electrical and mechanical specifications of a modular interconnect packaging system design for Automatic Test System (ATS) that can be applied in portable/benchtop and rack mounted versions. It specifically, describes a building block approach based upon the integration of four elements: (1) the mechanical chassis that forms the mechanical structure of the building block with alignment features to mate with other enclosures [building blocks], optional test interface choice emulating DOD Interface Standards [1] [2]; (2) merging of VXI/PXI/M-Module [3] [4] [5] multi-standard instrumentation under a single plug&play platform along; (3) mechanical/electrical extension that couples the instrumentation directly to a pluggable test interface panel of choice that connects to the Unit-Under-Test (UUT); and (4) a new pluggable virtual power source. These elements serve to significantly downsize footprint, reduce costs, reuse existing VXI inventory and integrate multi-standard instruments in a common platform, improve maintainability, support organic plug&play integration and enhance current VXI-based DOD ATS (Fig.1), or commercial ATS applications.