{"title":"An accurate and complete frequency dependent transmission line characterization using S-parameter measurements","authors":"T. Winkel","doi":"10.1109/EPEP.1999.819210","DOIUrl":null,"url":null,"abstract":"A very accurate and complete characterization of interconnects is presented. The method is based upon high-frequency S-parameter measurements of two lines of different lengths. The influence of the contact structures of the measurement probes are taken into account with the help of three additional measurements. A comparison of results obtained from measurements on a silicon substrate and from calculations is given and shows excellent agreement.","PeriodicalId":299335,"journal":{"name":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1999.819210","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
A very accurate and complete characterization of interconnects is presented. The method is based upon high-frequency S-parameter measurements of two lines of different lengths. The influence of the contact structures of the measurement probes are taken into account with the help of three additional measurements. A comparison of results obtained from measurements on a silicon substrate and from calculations is given and shows excellent agreement.