Groundbounce in ASIC's: model and test results

L. Díaz-Olavarrieta
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引用次数: 5

Abstract

Groundbounce is the noise produced by simultaneous switching of drivers in an ASIC, due to excessive current drawn from the power supply at the time of switching. This noise may cause delay and false triggering problems at the functional level, as well as emissions problems due to the fast rise time and amplitude of current spikes induced. Test results which attest to the seriousness of the groundbounce problem in large ASICs are presented. The importance of the positioning of switching drivers as a factor in reducing groundbounce is discussed. The model of groundbounce is detailed to include layout and package parameters, in order to more accurately calculate the effective inductance value to be used for predictions. The results presented correspond to groundbounce voltages measured in one test chip mounted on a PGA package.<>
ASIC的地弹跳:模型和测试结果
地跳是由ASIC中驱动器的同时开关产生的噪声,由于在开关时从电源中提取的电流过大。这种噪声可能在功能水平上引起延迟和误触发问题,以及由于引起的电流尖峰的快速上升时间和幅度而产生的排放问题。测试结果证明了大型集成电路中地跳问题的严重性。讨论了开关驱动器的定位作为减少地跳的一个因素的重要性。为了更准确地计算出用于预测的有效电感值,详细介绍了地跳模型,包括布局和封装参数。所给出的结果与安装在PGA封装上的一个测试芯片上测量的地跳电压相对应。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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