J. Plouchart, J. Kim, J. Gross, R. Trzcinski, K. Wu
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引用次数: 7
Abstract
This paper presents the high-frequency performance of the 130 and 90-nm SOI technologies as well as its integration capabilities and scalability. With a measured 303-GHz Ft, 1.6-mS//spl mu/m gm, and sub 1.1-dB NFmin up to 26-GHz the SOI NMOS transistors exhibits performances ahead of the ITRS roadmap. Passives are integrated in the microprocessor back-end, and the 1.8fF//spl mu/m/sup 2/ capacitance density of the vertical native capacitor (VNCAP) in a 90nm SOI CMOS improves by 28%, as compared to a 120 nm SOI CMOS. In the circuit design section, we will show how this high-level of performance will expand the use of CMOS to high-performance millimeter-wave applications with examples of such circuits for frequency generation, and amplification.
本文介绍了130纳米和90纳米SOI技术的高频性能及其集成能力和可扩展性。SOI NMOS晶体管的测量Ft为303 ghz, 1.6 ms //spl μ m / gm, NFmin低于1.1 db,最高可达26 ghz,其性能领先于ITRS路线图。无源集成在微处理器后端,与120nm SOI CMOS相比,90nm SOI CMOS中垂直原生电容器(VNCAP)的1.8fF//spl mu/m/sup 2/电容密度提高了28%。在电路设计部分,我们将通过频率产生和放大电路的示例,展示这种高水平的性能如何将CMOS的使用扩展到高性能毫米波应用中。