{"title":"New approach: Sample preparation methodology for P-V metal void inspection","authors":"P. Chou, Ruchang Lin, T. Chen","doi":"10.1109/IPFA.2009.5232571","DOIUrl":null,"url":null,"abstract":"The metal void information is very important for engineers to monitor the stability of the process and equipment during mass production and process tuning. However, traditional methods (X-S and P-V) are not efficient for metal void inspection. Therefore, the novel methodology is developed in this paper to provide a time efficient sample preparationm ethod and acceptable view region for plane-view metal void inspection instead of traditional methodology. This new approach involves the bevel polish technique and metal void inspection procedure. Thus the sample will be efficiently polished on a small slope and each layer could be inspected in the SEM simultaneously. By using this methodology can create a large inspection area for metal voids and dramatically reduce the cycle time of metal void inspection procedure to help engineers quickly get accurate metal void information.","PeriodicalId":210619,"journal":{"name":"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2009.5232571","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The metal void information is very important for engineers to monitor the stability of the process and equipment during mass production and process tuning. However, traditional methods (X-S and P-V) are not efficient for metal void inspection. Therefore, the novel methodology is developed in this paper to provide a time efficient sample preparationm ethod and acceptable view region for plane-view metal void inspection instead of traditional methodology. This new approach involves the bevel polish technique and metal void inspection procedure. Thus the sample will be efficiently polished on a small slope and each layer could be inspected in the SEM simultaneously. By using this methodology can create a large inspection area for metal voids and dramatically reduce the cycle time of metal void inspection procedure to help engineers quickly get accurate metal void information.