2D and 3D TCAD simulation of III-V channel FETs at the end of scaling

P. Aguirre, M. Rau, A. Schenk
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引用次数: 4

Abstract

Quantum drift diffusion corrections and a simple ballistic mobility model are used to simulate IdVgs-characteristics of scaled 2D and 3D III-V channel FETs. The sub-threshold swing of double-gate ultra-thin-body geometries is extracted for different gate lengths, and the semi-classical results are compared with those from the quantum transport simulator QTx. The ballistic mobility recovers the QTx transfer curves of the gate-all-around nanowire FETs, except the on-currents in the linear regime. It is shown that source-to-drain tunneling sets a limit to scaling at a gate length of about 10 nm.
缩放结束时III-V沟道场效应管的二维和三维TCAD仿真
采用量子漂移扩散修正和简单的弹道迁移率模型模拟了二维和三维III-V沟道场效应管的idvgs特性。提取了不同栅极长度下双栅极超薄体几何形状的亚阈值摆动,并与量子输运模拟器QTx的半经典结果进行了比较。弹道迁移率恢复了栅极全能纳米线场效应管的QTx转移曲线,但导通电流处于线性区。结果表明,源极到漏极的隧道效应在栅极长度约10 nm处对结垢有限制。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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