Analysis of Breakdown Characteristics of AIGaN/GaN HEMTs with Low- $k$ IHigh- $k$ Double Passivation Layers Paper Title

K. Nakamura, H. Hanawa, K. Horio
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Abstract

Two-dimensional analysis of off-state drain current-drain voltage characteristics in AIGaN/GaN high electron mobility transistors is performed; where two cases with a single passivation layer (SiN or high- $k$ dielectric) and double passivation layers (SiN and high- $k$ dielectric) are compared. It is shown that in the case of double passivation layers, the breakdown voltage is enhanced significantly as compared to the case of SiN single passivation layer when comparing at the same insulator thickness. This is because the electric field around the drain edge of gate is weakened. However, it is lowered remarkably as compared to the case with a high- $k$ single passivation layer even if the first SiN layer is rather thin. Also, in the case of double passivation layers, the breakdown voltage is shown to become close to the case with high- $k$ passivation layer when the relative permittivity of the second passivation layer becomes high and the SiN layer is thin.
低-高- k双钝化层AIGaN/GaN hemt击穿特性分析
对AIGaN/GaN高电子迁移率晶体管的失态漏极电流-漏极电压特性进行了二维分析;其中比较了单钝化层(SiN或高k介电介质)和双钝化层(SiN和高k介电介质)的两种情况。结果表明,在相同绝缘子厚度下,双钝化层的击穿电压明显高于单钝化层的击穿电压。这是因为栅极漏极边缘周围的电场被削弱了。然而,与高k单钝化层相比,即使第一层SiN相当薄,它也明显降低。在双钝化层的情况下,当第二钝化层的相对介电常数变大而SiN层变薄时,击穿电压接近高k钝化层的情况。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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