Effect of Ni-coated carbon nanotubes on interfacial intermetallic layer growth

2009 11th Electronics Packaging Technology Conference Pub Date : 2009-12-01 DOI:10.1109/EPTC.2009.5416534

Y.D. Han, H. Jing, S. Nai, L.Y. Xu, C. Tan, J. Wei

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引用次数: 2

Abstract

In the present study, Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into the Sn-Ag-Cu matrix, to form a composite solder. The interfacial intermetallic compound layer thickness formed on electroless nickel immersion gold (ENIG) metallized Cu substrate was determined under the as-soldered condition. It was observed that the addition of 0.01 wt.% Ni-CNTs into the Sn-Ag-Cu solder matrix, affected the formation of intermetallic compounds during the soldering reaction. For the reaction between the composite solder and the ENIG/Cu substrate, (Cu1−xNix)6Sn5 and (Cu1−yNiy)3Sn4 were formed. The test results revealed that the thickness of interfacial IMC decreased from 2.30 μm to 1.84 μm with the addition of Ni-CNTs. Shear tests were also conducted on the as-soldered solder joints. The shear test results revealed that the composite solder joint exhibited a ~ 15% increase in yield strength and a ~ 17% increase in ultimate shear strength, as compared to its monolithic counterpart.

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ni包覆碳纳米管对界面金属间层生长的影响

在本研究中，将ni包覆碳纳米管(Ni-CNTs)掺入Sn-Ag-Cu基体中，形成复合焊料。在焊接状态下，测定了化学镀镍金(ENIG)金属化Cu衬底上形成的界面金属间化合物层厚度。结果表明，在Sn-Ag-Cu钎料基体中加入0.01 wt.%的Ni-CNTs会影响焊接反应过程中金属间化合物的形成。复合钎料与ENIG/Cu衬底反应形成(Cu1−xNix)6Sn5和(Cu1−yNiy)3Sn4。结果表明，Ni-CNTs的加入使界面IMC厚度从2.30 μm减小到1.84 μm;对焊接后的焊点进行了剪切试验。剪切试验结果表明，与单一焊点相比，复合焊点的屈服强度提高了~ 15%，极限抗剪强度提高了~ 17%。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2009 11th Electronics Packaging Technology Conference

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