45nm Bit-Interleaving Differential 10T Low Leakage FinFET Based SRAM with Column-Wise Write Access Control

Vishal Gupta, Vishal Gupta, S. Khandelwal, J. Mathew, M. Ottavi
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引用次数: 7

Abstract

On-chip SRAM array occupies a large area in the microprocessor ICs. This enforces the technology to reach nano-scale domain. In this domain, minimizing the short channel effects, leakage current and improving reliability of memory cell are significant and challenging. FinFET device reduces the short channel effects, leakage current and enhances the performance of the SRAM cell at 45nm technology node and beyond. This paper presents supply voltage management technique for designing a low-power and variability-aware SRAM cell. In this paper, we propose a FinFET based differential $10T$ SRAM cell using Drowsy Cache architecture for leakage power reduction at 45nm technology node. The proposed differential $10 T$ SRAM permits bit interleaving with column-wise write access control, having differential read path, thus, improving reliability of the SRAM cell. The proposed circuit also restricts pseudoread problem, by allowing column-wise write in SRAM cell array. The simulation has been carried out on Cadence Virtuoso at 45nm technology node.
45nm位交错差分10T低漏FinFET基于SRAM与列明智的写访问控制
片上SRAM阵列在微处理器集成电路中占有很大的面积。这将使该技术达到纳米级领域。在这一领域中,最小化短通道效应、泄漏电流和提高存储单元的可靠性具有重要的意义和挑战性。FinFET器件减少了短通道效应,泄漏电流,提高了SRAM电池在45nm及以上技术节点的性能。本文提出了一种用于设计低功耗可变感知SRAM单元的电源电压管理技术。在本文中,我们提出了一种基于FinFET的差分$10T$ SRAM单元,使用休眠缓存架构来降低45nm技术节点的泄漏功率。提出的差分$10 T$ SRAM允许位交错与列式写访问控制,具有差分读路径,从而提高SRAM单元的可靠性。该电路还通过允许SRAM单元阵列的逐列写入来限制伪读问题。在Cadence Virtuoso上进行了45nm工艺节点的仿真。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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