L. Goux, A. Fantini, A. Redolfi, C. Y. Chen, F. Shi, R. Degraeve, Y. Chen, Thomas Witters, Guido Groeseneken, Malgorzata Jurczak
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引用次数: 44
Abstract
We engineer a scalable and CMOS-friendly RRAM stack using down to 3nm ALD-based Ta2O5. The 20nm-sized TiN\Ta2O5\Ta device operated at 50μA exhibits ultra-fast write (~5ns) at moderate voltage (<;2V) with >109 write endurance. We also demonstrate excellent disturb and retention characteristics, which we relate to the appropriate tuning of the oxygen chemical-potential profile along the filament by means of the Ta scavenger material and thickness.