Analysis of failure mechanisms in erased state of sub 20-nm NAND Flash memory

Kyunghwan Lee, Duckseoung Kang, Hyungcheol Shin, S. Kwon, Shinhyung Kim, Yuchul Hwang
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引用次数: 11

Abstract

In this paper, we analyzed the characteristics of dominant failure mechanisms in the erased (ERS) state of sub 20-nm NAND Flash memory with an accurate compact model. As a result, it was observed that various charge loss and charge gain mechanisms are mixed together. While the detrapping and the interface trap recovery (Nit) mechanism contribute to the charge loss, the trap-assisted tunneling (TAT) is the charge gain mechanism in the ERS state due to the negative electric field across tunneling oxide layer. At the less cycled cells, the charge gain is dominant due to the TAT mechanism. However, as increasing the cycling times, the detrapping component becomes larger by trapped carriers and the TAT component gets reduced as the detrapped electrons raise the energy level of floating gate (FG) and energy barrier of tunneling oxide layer. Therefore, the charge loss becomes dominant at increased cycling times.
亚20nm NAND闪存擦除失效机理分析
本文采用精确的紧凑模型分析了亚20纳米NAND闪存擦除(ERS)状态的主要失效机制特征。结果,观察到各种电荷损失和电荷增益机制混合在一起。脱陷和界面阱恢复(Nit)机制是导致电荷损失的原因,而阱辅助隧穿(TAT)是ERS态下电荷增益的机制,这是由于穿过隧道氧化层的负电场造成的。在较少循环的电池中,由于TAT机制,电荷增益占主导地位。然而,随着循环次数的增加,被困载流子的脱阱分量增大,TAT分量减小,因为被困电子提高了浮栅(FG)和隧道氧化层的能垒能级。因此,随着循环次数的增加,电荷损失占主导地位。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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