On leakage currents: sources and reduction for transistors, gates, memories and digital systems

W. Nebel, D. Helms
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引用次数: 0

Abstract

Summary form only given. In only 5 years, leakage developed from an academic corner phenomenon to a central problem of embedded system design. In sub 90 nm designs the leakage power is already exceeding the dynamic power. The intention of this tutorial is to first review the mechanisms causing leakage and the parameters and imperfections causing leakage variation as the dependencies on physical parameters as temperature, voltage levels, device geometry, doping levels, etc. Afterwards, the state-of-the-art in leakage reduction and management methodologies is presented with a first focus on transistor design including well engineering, high-k, strained silicon, SGOI devices, fully depleted ultra thin body SOI, as well as FinFETs. Then, technical aspects on the leakage management techniques power gating, body and supply voltage scaling and minimum leakage vector are discussed. Finally, low leakage SRAM cell design and different cache decay techniques are presented.
关于泄漏电流:晶体管,栅极,存储器和数字系统的源和减少
只提供摘要形式。在短短5年的时间里,泄漏从一个学术的角落现象发展成为嵌入式系统设计的核心问题。在90纳米以下的设计中,泄漏功率已经超过了动态功率。本教程的目的是首先回顾导致泄漏的机制,以及导致泄漏变化的参数和缺陷,如温度,电压水平,器件几何形状,掺杂水平等物理参数的依赖关系。然后,介绍了最先进的泄漏减少和管理方法,首先重点介绍了晶体管设计,包括井工程,高k,应变硅,SGOI器件,完全耗尽超薄体SOI以及finfet。然后,讨论了泄漏管理技术的技术方面,包括电源门控、本体和电源电压缩放和最小泄漏矢量。最后,介绍了低泄漏SRAM单元的设计和不同的缓存衰减技术。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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