Extension of the Capabilities of SPICE Analysis Tools for Electro-Thermal Simulation of Power Electronic Circuits

Abstract

The paper presents developed software tools for extension of the capabilities of SPICE analysis tools for electro-thermal simulation of power electronic circuits. The tools provide: automated circuit elements power definition and temperature-power transfer between circuit and thermal simulation software tools, automated generation of thermal networks for components including heat sink selection. Examples of using only generated thermal network (without electronic circuit) simulation with SPICE software are also presented. Such approach allows to significantly accelerate the electro-thermal simulation process. Iterative electro-thermal procedure using only SPICE simulation software and thermal networks automatically generated by the developed tool is illustrated and it is shown that it allows to quickly estimate thermal modes of power components and to prevent thermal failures for electronic components.