High quality ultra-thin (4 nm) gate oxide by UV/O/sub 3/ surface pre-treatment of native oxide

S. Ohkubo, Y. Tamura, R. Sugino, T. Nakanishi, Y. Sugita, N. Awaji, K. Takasaki
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Abstract

A significant improvement in ultra-thin (4 nm) gate oxide quality has been carried out using UV/O/sub 3/ pre-treatment of native oxide before thermal oxidation. UV/O/sub 3/ pre-treatment makes native oxide dense and close-packed without leaving any residue species. Ultra-thin gate oxide formed by UV/O/sub 3/ pre-treatment and O/sub 3/ oxidation has been found to have excellent behavior, low leakage current, low surface state density, and superior dielectric breakdown characteristics. UV/O/sub 3/ pre-treatment looks promising for using in ultra-thin gate oxidation necessary for 0.1 /spl mu/m ULSI fabrication.
采用UV/O/sub - 3/表面预处理的高品质超薄(4nm)栅极氧化物
在热氧化前对天然氧化物进行UV/O/sub - 3预处理,显著改善了超薄(4nm)栅极氧化物的质量。UV/O/sub - 3/预处理使原生氧化物致密、密实,不留任何残留物质。经UV/O/sub - 3/预处理和O/sub - 3/氧化制备的超薄栅极氧化物具有优异的性能、低泄漏电流、低表面态密度和优异的介电击穿特性。UV/O/sub - 3/预处理有望用于0.1 /spl mu/m ULSI制造所需的超薄栅氧化。
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