Early lifetime failure detection in FPGAs using delay faults

K. Vittala, M. Niamat, S. Vemuru
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引用次数: 2

Abstract

The reduction in the transistor and interconnect dimensions have a severe impact on the reliable performance of the Field Programmable Gate Array (FPGA) circuits. The process variation effects in nanometer scale technologies result in transient errors or permanent failures that cause undesired behavior of the circuit. In this work, we analyze a method for fault identification to mitigate the impact of lifetime failures such as Electro-migration (EM) and Hot Carrier Effect (HCE) in interconnect of the FPGA. This method is based on the signal delays in routing resources that include switch blocks and interconnect wires.
基于延迟故障的fpga早期寿命失效检测
晶体管和互连尺寸的减小严重影响了现场可编程门阵列(FPGA)电路的可靠性能。纳米尺度技术中的工艺变化效应会导致电路的瞬态误差或永久失效,从而导致电路的不良行为。在这项工作中,我们分析了一种故障识别方法,以减轻FPGA互连中电迁移(EM)和热载流子效应(HCE)等寿命失效的影响。这种方法是基于路由资源的信号延迟,包括交换块和互连线。
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