Thermal Resistance Formulation and Analysis of III-V FETs Based on DC Electrical Data

D. Root, Jianjun Xu, M. Iwamoto
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引用次数: 1

Abstract

This paper presents a unified framework for estimating the thermal resistance of a FET from DC drain current data. A mathematical derivation from physical principles is presented for a recently introduced practical expression for thermal resistance that is obtained from easily acquired DC data. Limitations of this expression are identified and circumvented by extending the formalism with a partial differential equation for temperature-dependent thermal resistance. This partial differential equation for thermal resistance is solved by numerical analysis of bias-dependent DC data versus temperature using the adjoint artificial neural network training procedure. Results applied to measured data from GaAs and GaN FET technologies demonstrate that the proposed method enables predictions (estimates) over a wide range of device operating conditions in bias and temperature.
基于直流电学数据的III-V型场效应管热阻公式及分析
本文提出了从直流漏极电流数据估计场效应管热阻的统一框架。本文从物理原理出发,给出了一种实用的热阻表达式的数学推导,该表达式是由易于获取的直流数据得到的。通过用温度相关热阻的偏微分方程扩展形式来识别和规避该表达式的局限性。该热阻偏微分方程通过使用伴随人工神经网络训练程序对偏置相关直流数据与温度的数值分析来求解。应用于GaAs和GaN FET技术的测量数据的结果表明,所提出的方法可以在偏置和温度的广泛器件工作条件下进行预测(估计)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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