Universal Membrane Probe for Known Good Die

Abstract

We propose a new type of membrane probe, which might be called a Universal Membrane Probe (UMP), as a standard Known-Good Die (KGD) solution for Multi Chip Module (MCM) manufacture. In this paper we will give an outline of this new probe, describe the newly developed manufacturing process for it, and evaluate the performance of a prototype probe. The features of this probe are firstly that it is disposable and based on low-cost materials such as Tape Automated Bonding (TAB) tape; secondly, it is non-customized and so applicable to a wide variety of die sizes and pad configurations; and finally it potentially offers a new standard for wafer probing.