Smart Manufacturing Technologies for Printed Electronics

Saleem Khan, Shawkat Ali, A. Bermak
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引用次数: 12

Abstract

Fabrication of electronic devices on different flexible substrates is an area of significant interest due to low cost, ease of fabrication, and manufacturing at ambient conditions over large areas. Over the time, a number of printing technologies have been developed to fabricate a wide range of electronic devices on nonconventional substrates according to the targeted applications. As an increasing interest of electronic industry in printed electronics, further expansion of printed technologies is expected in near future to meet the challenges of the field in terms of scalability, yield, and diversity and biocompatibility. This chapter presents a comprehensive review of various printing electronic technologies commonly used in the fabrication of electronic devices, circuits, and systems. The different printing techniques based on contact/noncontact approach of the printing tools with the target substrates have been explored. These techniques are assessed on the basis of ease of operation, printing resolutions, processability of materials, and ease of optimization of printed structures. The various technical challenges in printing techniques, their solutions with possible alternatives, and the potential research directions are highlighted. The latest developments in assembling various printing tools for enabling high speed and batch manufacturing through roll-to-roll systems are also explored.
印刷电子的智能制造技术
在不同柔性基板上制造电子器件是一个非常有趣的领域,因为成本低,易于制造,并且在大面积的环境条件下制造。随着时间的推移,许多印刷技术已经发展到根据目标应用在非常规基材上制造各种各样的电子器件。随着电子工业对印刷电子的兴趣日益浓厚,印刷技术有望在不久的将来进一步扩展,以满足该领域在可扩展性、产量、多样性和生物相容性方面的挑战。本章全面回顾了电子器件、电路和系统制造中常用的各种印刷电子技术。探讨了基于印刷工具与目标基材接触/非接触方式的不同印刷技术。这些技术是根据操作的便利性、打印分辨率、材料的可加工性和易于优化打印结构来评估的。强调了印刷技术中的各种技术挑战,其解决方案和可能的替代方案以及潜在的研究方向。还探讨了通过卷对卷系统组装各种印刷工具以实现高速和批量制造的最新发展。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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