{"title":"Re-examination of Deuterium Effect on Negative Bias Temperature Instability in Ultra-thin Gate Oxides","authors":"Y. Mitani, H. Satake","doi":"10.1109/ICICDT.2006.220806","DOIUrl":null,"url":null,"abstract":"In this work, the effect of deuterium on negative bias temperature instability (NBTI) was investigated using p+-gate and n+ -gate/pMOSFETs. As a result, it was found that the elimination of interface-trap generation by deuterium incorporation is observed in the case of n+-gate/pMOSFETs, while no isotope effect is observed in p+-gate/pMOSFETs. The correlation between energy of injected carrier and interface trap generation was investigated based on the impact ionization probability. In the case of p+-gate/pMOSFETs, the interaction between Si-H bonds and holes in the inversion layer seems to be responsible for hydrogen release from SiO2/Si interface. On the other hand, in the case of n+-gate/pMOSFETs, injecting energetic electrons from gate electrodes break Si-H bonds. Namely, it can be concluded that two processes of Si-H bond breaking relate to interface trap generation under NBT stress","PeriodicalId":447050,"journal":{"name":"2006 IEEE International Conference on IC Design and Technology","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-08-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 IEEE International Conference on IC Design and Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICICDT.2006.220806","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
In this work, the effect of deuterium on negative bias temperature instability (NBTI) was investigated using p+-gate and n+ -gate/pMOSFETs. As a result, it was found that the elimination of interface-trap generation by deuterium incorporation is observed in the case of n+-gate/pMOSFETs, while no isotope effect is observed in p+-gate/pMOSFETs. The correlation between energy of injected carrier and interface trap generation was investigated based on the impact ionization probability. In the case of p+-gate/pMOSFETs, the interaction between Si-H bonds and holes in the inversion layer seems to be responsible for hydrogen release from SiO2/Si interface. On the other hand, in the case of n+-gate/pMOSFETs, injecting energetic electrons from gate electrodes break Si-H bonds. Namely, it can be concluded that two processes of Si-H bond breaking relate to interface trap generation under NBT stress