Drain Bias Dependence of Gate Oxide Reliability in Conventional and Asymmetrical Channel MOSFETs in the Low Voltage Regime

K. Anil, S. Mahapatra, I. Eisele, V. Rao, J. Vasi
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引用次数: 3

Abstract

Drain bias dependence of gate oxide reliability is investigated on conventional (CON) and Lateral Asymmetric Channel (LAC) MOSFETs for low drain voltages that correspond to the real operating voltages for deep-sub-micron devices. For short channel devices, the oxide reliability improves drastically as drain bias increases. Device simulations showed that the vertical field distribution in the oxide is asymmetric for non-zero drain biases and this results in an asymmetric gate current distribution with the peak at the source end. By introducing an intentionally graded doping profile along the channel (LAC), the asymmetry in the vertical filed distribution can be enhanced with consequent improvement in gate oxide reliability.
低电压下传统和非对称沟道mosfet栅极氧化物可靠性的漏极偏置依赖性
在与深亚微米器件实际工作电压相对应的低漏极电压条件下,研究了传统(CON)和横向非对称通道(LAC) mosfet栅极氧化物可靠性的漏极偏置依赖性。对于短通道器件,氧化物的可靠性随着漏极偏置的增加而急剧提高。器件模拟表明,对于非零漏极偏置,氧化物中的垂直场分布是不对称的,这导致栅极电流分布不对称,峰值在源端。通过在沟道(LAC)上有意地引入梯度掺杂剖面,可以增强垂直场分布的不对称性,从而提高栅氧化物的可靠性。
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