High Q MMIC spiral inductor study using production silicon process

D. Badiere, C. Nicholls, J. Wight
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Abstract

This paper documents the results of a study based on measurements of 240 microwave monolithic spiral inductors fabricated using an industry standard silicon process. Measurements at frequencies between 1GHz and 40GHz are presented which demonstrate inductance values of 0.4nH are achievable at 15GHz with quality factors of 20. To the authors' knowledge this is one of the highest reported Qs of a monolithic inductor created in a standard RF silicon process. Four square and four octagonal inductors were design with target inductances of 0.4nH, 0.5nH, 1.0nH, and 1.5nH. Each inductor was fabricated three ways: in top metal only, in top and second from top metal layers with the layers joined by vias along the length of the inductor, and in top metal with a 1µm wide trench in the silicon substrate between the inductor windings. Ten of each inductor version were measured to increase the statistical significance of the results. Three de-embedding techniques for removing pad and feed line parasitics from the inductor measurements are discussed. As well, the efficacy of HP EEsof Series IV Momentum in predicting the performance of one of the square inductors is presented.
高Q MMIC螺旋电感的硅制程研究
本文记录了一项基于测量240个微波单片螺旋电感器的研究结果,这些电感器采用工业标准硅工艺制造。给出了在1GHz和40GHz频率范围内的测量结果,表明在15GHz频率下可以实现0.4nH的电感值,质量因子为20。据作者所知,这是在标准射频硅工艺中创建的单片电感器的最高Qs报告之一。设计4个方形电感和4个八角形电感,目标电感分别为0.4nH、0.5nH、1.0nH和1.5nH。每个电感器有三种制造方法:仅在顶部金属层中制造,在顶部和第二层金属层中制造,各层沿着电感器的长度通过过孔连接,以及在顶部金属中制造电感器绕组之间的硅衬底上有1 μ m宽的沟槽。测量每个电感器版本的10个,以增加结果的统计显著性。讨论了从电感测量中去除衬垫和馈线寄生的三种去嵌入技术。此外,还介绍了HP EEsof系列IV动量在预测其中一个方形电感器性能方面的有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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