What comes after most semiconductor fabs are "outsourced" to Asia? Major challenges in educating future RF/analog IC designers in the U.S

D. Lie
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Abstract

What comes after most state-of-the-art semiconductor fabs are moved to Asia? Would this trend fundamentally change the educational needs of students in the U.S. majoring in electrical engineering (E.E.)? This paper lists several major challenges for educating future RF/analog integrated circuit (IC) designers in the U.S in light of this "outsourcing" trend. The outline of a 3-quarter graduate-level RF/analog IC design series (ECE265ABC) that the author has been privileged to teach at UC San Diego (UCSD) is discussed to address some of those specific challenges.
大多数半导体工厂“外包”到亚洲之后会发生什么?在美国培养未来RF/模拟IC设计人员的主要挑战
大多数最先进的半导体工厂搬到亚洲后会发生什么?这种趋势会从根本上改变美国电气工程专业学生的教育需求吗?鉴于这种“外包”趋势,本文列出了在美国培养未来RF/模拟集成电路(IC)设计人员的几个主要挑战。本文讨论了作者有幸在加州大学圣地亚哥分校(UCSD)教授的3 / 4研究生水平RF/模拟IC设计系列(ECE265ABC)的大纲,以解决其中的一些具体挑战。
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