Whayoung Kim, Jaehyeong Kim, D. Ko, Jun-Hwe Cha, Gyeongcheol Park, Y. Ahn, Jong-Young Lee, Minchul Sung, Hyejung Choi, S. Ryu, Seiyon Kim, Myung-Hee Na, Seonyong Cha
{"title":"Demonstration of crystalline IGZO transistor with high thermal stability for memory applications","authors":"Whayoung Kim, Jaehyeong Kim, D. Ko, Jun-Hwe Cha, Gyeongcheol Park, Y. Ahn, Jong-Young Lee, Minchul Sung, Hyejung Choi, S. Ryu, Seiyon Kim, Myung-Hee Na, Seonyong Cha","doi":"10.23919/VLSITechnologyandCir57934.2023.10185258","DOIUrl":null,"url":null,"abstract":"Highly ordered crystalline InGaZnO (c-IGZO) TFTs have been demonstrated in subsequent processes above 550 °C compatible with memory applications. Notably, c-IGZO featured strong immunity to high temperature and hydrogen-containing processes unlike amorphous IGZO (a-IGZO) where agglomeration occurs. The c-IGZO TFTs with optimized process in this study show a higher on-current ($\\mathrm{I}_{\\mathrm{o}\\mathrm{n}}$) at a similar $\\mathrm{V}_{\\mathrm{t}\\mathrm{h}}$ of −1 V, and $\\mathrm{I}_{\\mathrm{off}}$ of $1.82\\times 10^{-18}$ A/$\\mu$m compared with a-IGZO TFTs. In addition, striking enhancement in the short channel margin and $\\mathrm{V}_{\\mathrm{th}}$ stability over a-IGZO was achieved. With thin gate-oxide (50 Å), the improved device performance was realized such as S.S. $\\times$ 0.41, DIBL $\\times$ 0.18, and $\\mathrm{I}_{\\mathrm{on}}$× 76.5 compared with a-IGZO TFT at $\\mathrm{T}_{\\mathrm{ox}}$ 100 Å.","PeriodicalId":317958,"journal":{"name":"2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","volume":"37 XI 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-06-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185258","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Highly ordered crystalline InGaZnO (c-IGZO) TFTs have been demonstrated in subsequent processes above 550 °C compatible with memory applications. Notably, c-IGZO featured strong immunity to high temperature and hydrogen-containing processes unlike amorphous IGZO (a-IGZO) where agglomeration occurs. The c-IGZO TFTs with optimized process in this study show a higher on-current ($\mathrm{I}_{\mathrm{o}\mathrm{n}}$) at a similar $\mathrm{V}_{\mathrm{t}\mathrm{h}}$ of −1 V, and $\mathrm{I}_{\mathrm{off}}$ of $1.82\times 10^{-18}$ A/$\mu$m compared with a-IGZO TFTs. In addition, striking enhancement in the short channel margin and $\mathrm{V}_{\mathrm{th}}$ stability over a-IGZO was achieved. With thin gate-oxide (50 Å), the improved device performance was realized such as S.S. $\times$ 0.41, DIBL $\times$ 0.18, and $\mathrm{I}_{\mathrm{on}}$× 76.5 compared with a-IGZO TFT at $\mathrm{T}_{\mathrm{ox}}$ 100 Å.