Analyzing thermal runaway in semiconductor devices using the constrained method of optimization

V. Lakshminarayanan, N. Sriraam
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引用次数: 2

Abstract

Thermal runaway is a major cause of failure of semiconductor devices in electronic systems. Analyzing the conditions for thermal runaway and its prevention is important to prevent this failure mechanism. In this paper, the Lagrange's constrained method of optimization is applied to the problem of thermal runaway. Cases of thermal runaway in MOSFET,BJT and semiconductor ICs are discussed. A case of power generation and dissipation represented by a quadratic function in two-variables is taken as an example and the method of application is explained. The geometrical interpretation of the mathematical results is also discussed. Methods of prevention of thermal runaway in a few types of semiconductor components are given.
用约束优化方法分析半导体器件的热失控
热失控是电子系统中半导体器件失效的主要原因。分析热失控的发生条件及其预防措施,对预防这种失效机制具有重要意义。本文将拉格朗日约束优化方法应用于热失控问题。讨论了MOSFET、BJT和半导体集成电路中热失控的情况。以两变量二次函数表示的发电和耗散为例,说明了应用方法。本文还讨论了数学结果的几何解释。给出了几种类型的半导体元件中防止热失控的方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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