{"title":"Parallel plate slot coupler modeling using two dimensional frequency domain transmission line matrix method","authors":"R. Ito","doi":"10.1109/EPEP.2004.1407541","DOIUrl":null,"url":null,"abstract":"A slot coupler for coupling between via-defined waveguides is analyzed using the 2D frequency domain transmission line matrix (2D-TLM) method. The general 2D-TLM model for a slot coupling between parallel plate waveguides is useful in the design of advanced low cost millimeter-wave packaging. The via waveguide coupler is modeled and the model verified by comparison to measurement.","PeriodicalId":143349,"journal":{"name":"Electrical Performance of Electronic Packaging - 2004","volume":"23 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging - 2004","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2004.1407541","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9
Abstract
A slot coupler for coupling between via-defined waveguides is analyzed using the 2D frequency domain transmission line matrix (2D-TLM) method. The general 2D-TLM model for a slot coupling between parallel plate waveguides is useful in the design of advanced low cost millimeter-wave packaging. The via waveguide coupler is modeled and the model verified by comparison to measurement.