Jyi-Tsong Lin, Tzu-Feng Chang, Y. Eng, Hsuan-Hsu Chen, C. Kuo, Chih-Hung Sun, Po-Hsieh Lin, Hsien-Nan Chiu
{"title":"Self-aligned SOI MOSFETs with Ω-shaped conductive layer and source/drain-tie","authors":"Jyi-Tsong Lin, Tzu-Feng Chang, Y. Eng, Hsuan-Hsu Chen, C. Kuo, Chih-Hung Sun, Po-Hsieh Lin, Hsien-Nan Chiu","doi":"10.1109/IPFA.2009.5232558","DOIUrl":null,"url":null,"abstract":"In this paper, we propose a novel self-aligned silicon-on-insulator (SOI) MOSFET with Ω-shaped conductive layer and source/drain-tie (SA-ΩCFET). Based on the TCAD 2D simulation results, we find that combining the applications of a nature Source/Drain (S/D) tie with a recessed S/D region can effectively improve the issue of self-heating effects, but without losing control of the short-channel effects. Moreover, owing to the presence of the thick S/D junction thickness the parasitic S/D series resistance is reduced thus our proposed structure can gain a higher drain on-current and a higher maximum transconductance as compared with the conventional UTSOI device.","PeriodicalId":210619,"journal":{"name":"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2009.5232558","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
In this paper, we propose a novel self-aligned silicon-on-insulator (SOI) MOSFET with Ω-shaped conductive layer and source/drain-tie (SA-ΩCFET). Based on the TCAD 2D simulation results, we find that combining the applications of a nature Source/Drain (S/D) tie with a recessed S/D region can effectively improve the issue of self-heating effects, but without losing control of the short-channel effects. Moreover, owing to the presence of the thick S/D junction thickness the parasitic S/D series resistance is reduced thus our proposed structure can gain a higher drain on-current and a higher maximum transconductance as compared with the conventional UTSOI device.