Self-aligned SOI MOSFETs with Ω-shaped conductive layer and source/drain-tie

Jyi-Tsong Lin, Tzu-Feng Chang, Y. Eng, Hsuan-Hsu Chen, C. Kuo, Chih-Hung Sun, Po-Hsieh Lin, Hsien-Nan Chiu
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引用次数: 0

Abstract

In this paper, we propose a novel self-aligned silicon-on-insulator (SOI) MOSFET with Ω-shaped conductive layer and source/drain-tie (SA-ΩCFET). Based on the TCAD 2D simulation results, we find that combining the applications of a nature Source/Drain (S/D) tie with a recessed S/D region can effectively improve the issue of self-heating effects, but without losing control of the short-channel effects. Moreover, owing to the presence of the thick S/D junction thickness the parasitic S/D series resistance is reduced thus our proposed structure can gain a higher drain on-current and a higher maximum transconductance as compared with the conventional UTSOI device.
具有Ω-shaped导电层和源/漏极结的自对准SOI mosfet
在本文中,我们提出了一种具有Ω-shaped导电层和源/漏极结(SA-ΩCFET)的新型自对准绝缘体上硅(SOI) MOSFET。基于二维TCAD仿真结果,我们发现将自然源/漏(S/D)连接与嵌入S/D区域相结合可以有效地改善自热效应问题,但不会失去对短通道效应的控制。此外,由于厚S/D结厚度的存在,寄生S/D串联电阻降低,因此与传统的UTSOI器件相比,我们提出的结构可以获得更高的漏极导通电流和更高的最大跨导。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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