Keynote speech 2: Reconfigurable systems and 3D architectures

Abstract

Three-dimensional (3-D) integration has emerged as a revolutionary technology that can satisfy these requirements. The shift from horizontal scaling to volumetric stacking of circuits has the potential to mitigate the many limitations of modern integrated circuits. 3-D architectures contain multiple physical layers and offer considerable improvement in circuit performance, such as lower power/energy consumption, less total wire-length, higher integration density, and greater speed comparing with two-dimensional (2-D) circuits.