Simulation of self-heating in advanced high-speed SiGe bipolar circuits using the temperature simulator TESI

M. Pfost, R. Lachner, Hao Li
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引用次数: 15

Abstract

Advanced SiGe bipolar technologies now allow the realization of very-high-speed IC such as 40 Gbit/s multiplexers and 77 GHz automotive radar VCO, even if high output power levels are required. However, in such circuits self-heating often leads to high peak temperatures. This can decrease transistor performance and circuit lifetime and must, therefore, be considered during circuit design. In this paper we demonstrate how the temperature increase resulting from self-heating can be accurately determined already in the design phase. For this, we present the experimentally verified three-dimensional numerical temperature simulator TESI that was specifically developed for such problems. It is shown how this tool can be applied to investigate practical circuits using the core of a 40 Gbit/s power multiplexer and the buffer stage of a 77 GHz VCO with high output power as examples.
用温度模拟器TESI模拟先进高速SiGe双极电路的自热
先进的SiGe双极技术现在允许实现超高速IC,如40 Gbit/s多路复用器和77 GHz汽车雷达VCO,即使需要高输出功率水平。然而,在这种电路中,自热常常导致峰值温度升高。这可能会降低晶体管的性能和电路寿命,因此必须在电路设计时加以考虑。在本文中,我们演示了如何在设计阶段就可以准确地确定自热引起的温升。为此,我们提出了专门针对此类问题开发的经过实验验证的三维数值温度模拟器TESI。以40gbit /s功率复用器的核心和77ghz高输出功率VCO的缓冲级为例,说明了该工具如何应用于实际电路的研究。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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