Model to Hardware Matching For nano-meter Scale Technologies

S. Nassif
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Abstract

With the semiconductor industry pushing past the 65nm node and forward to 45nm and beyond, a host of phenomena are becoming prominent. For some time now, manufacturing variability and its impact on power and performance has captured the attention of the CAD research community, and is now transitioning to the commercial EDA market. Simultaneously, however, our ability to reliably predict the outcome of a semiconductor manufacturing process has been steadily deteriorating. This is happening because the rapidly increasing process complexity which is introducing a host of systematic sources of variation, as well as a natural increase in core random variability due to scaling. These factors increase the error in our performance predictions, and thus lead to a gap in model to hardware matching. In this tutorial, we will review the sources and impacts of model to hardware mismatch, and show examples of potential solutions to currently under development
纳米尺度技术的模型到硬件匹配
随着半导体产业从65纳米节点向45纳米甚至更远的节点推进,一系列现象变得越来越突出。一段时间以来,制造可变性及其对功率和性能的影响已经引起了CAD研究界的注意,现在正在向商业EDA市场过渡。然而,与此同时,我们可靠地预测半导体制造过程结果的能力一直在稳步恶化。这是因为快速增加的过程复杂性引入了大量的系统变异源,以及由于缩放导致的核心随机变异的自然增加。这些因素增加了我们性能预测的误差,从而导致模型与硬件匹配的差距。在本教程中,我们将回顾模型与硬件不匹配的来源和影响,并展示当前正在开发的潜在解决方案的示例
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