GaN HEMTs Design and Modeling for 5G

Yueying Liu, John Wood, Zongyang Hu, S. Ganguly, J. Fisher, M. Watts, S. Sheppard, D. Gajewski, Basim Noori
{"title":"GaN HEMTs Design and Modeling for 5G","authors":"Yueying Liu, John Wood, Zongyang Hu, S. Ganguly, J. Fisher, M. Watts, S. Sheppard, D. Gajewski, Basim Noori","doi":"10.1109/IRPS48203.2023.10117652","DOIUrl":null,"url":null,"abstract":"As GaN on SiC technology becomes accessible to commercial users for 5G applications, modeling needs from transistor to system level has become a big challenge for designers. In this work we demonstrated the strategy of using multi-physics modeling for a high power GaN HEMT PA design to achieve the stringent design target goal on the product level. The simulation result shows excellent agreement between measurements and models. Meanwhile, to facilitate the design process at system level, behavioral modeling is used to predict module level performance by integrating models in complex signal scheme environment. The final product used with Wolfspeed's 5G targeted process with reliability test validity is demonstrated in the paper as well.","PeriodicalId":159030,"journal":{"name":"2023 IEEE International Reliability Physics Symposium (IRPS)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE International Reliability Physics Symposium (IRPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS48203.2023.10117652","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

As GaN on SiC technology becomes accessible to commercial users for 5G applications, modeling needs from transistor to system level has become a big challenge for designers. In this work we demonstrated the strategy of using multi-physics modeling for a high power GaN HEMT PA design to achieve the stringent design target goal on the product level. The simulation result shows excellent agreement between measurements and models. Meanwhile, to facilitate the design process at system level, behavioral modeling is used to predict module level performance by integrating models in complex signal scheme environment. The final product used with Wolfspeed's 5G targeted process with reliability test validity is demonstrated in the paper as well.
5G GaN hemt设计与建模
随着5G应用的商业用户可以使用GaN on SiC技术,从晶体管到系统级的建模需求已成为设计人员面临的一大挑战。在这项工作中,我们展示了在高功率GaN HEMT PA设计中使用多物理场建模的策略,以在产品层面上实现严格的设计目标。仿真结果表明,实测数据与模型吻合良好。同时,为了方便系统级的设计过程,通过对复杂信号方案环境下的模型进行集成,利用行为建模来预测模块级的性能。文中还展示了Wolfspeed 5G目标工艺的最终产品,并进行了信度测试效度的验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信