Failure analysis in the integrated fabless manufacturer (IFM) environment

A.G. Street
{"title":"Failure analysis in the integrated fabless manufacturer (IFM) environment","authors":"A.G. Street","doi":"10.1109/IPFA.2009.5232713","DOIUrl":null,"url":null,"abstract":"Failure analysis tools and techniques have been evolving since engineers first took electronic components apart to see why they failed. First, using existing tools like optical microscopes, electrical test bench instruments and the machine shop to electrically and physically peer inside failed parts, failure analysts developed new methods, and later new tools to look inside electronic components and see physical structures and electrical signals. At the same time, the role failure analysis plays in the design and development cycle of systems and has expanded well beyond the original focus of quality and reliability.","PeriodicalId":210619,"journal":{"name":"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2009.5232713","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

Failure analysis tools and techniques have been evolving since engineers first took electronic components apart to see why they failed. First, using existing tools like optical microscopes, electrical test bench instruments and the machine shop to electrically and physically peer inside failed parts, failure analysts developed new methods, and later new tools to look inside electronic components and see physical structures and electrical signals. At the same time, the role failure analysis plays in the design and development cycle of systems and has expanded well beyond the original focus of quality and reliability.
集成无晶圆厂(IFM)环境下的失效分析
故障分析工具和技术一直在发展,因为工程师们第一次把电子元件拆开,看看它们为什么会失败。首先,使用现有的工具,如光学显微镜、电气测试台仪器和机械车间,对故障部件进行电气和物理检查,故障分析人员开发了新方法,后来又开发了新工具,以查看电子元件内部并查看物理结构和电信号。与此同时,失效分析在系统的设计和开发周期中所起的作用已经远远超出了原来的质量和可靠性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信