Nondestructive diagnosis of thick production-line microelectronic components using transmission acoustic microscope

Abstract

We have employed a 150 MHz transmission acoustic microscope to study the bonded regions of three additional types of thick production line hybrid microelectronic components, namely, high power silicon transistors, thin- and thick-film circuits, and multilayer chip-capacitors. We have detected defects located deep inside these components and have succeeded in identifying and characterizing some of the defects such as alloy spikes, inclusions, voids, and lack of bonds.