Influence of fin-width lateral variations of a FinFET

C. Prawoto, M. Cheralathan, M. Chan
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引用次数: 2

Abstract

We have presented that, in terms of subthreshold operation, IOFF, SS and DIBL are improved in response to higher degree of lateral thickness non-uniformity. We have shown that the linearly varying film thickness of a FinFET introduces effects comparable to small variations in overall thickness. To address the non-uniformity, a correction factor for the overall thickness based on IOFF could be employed. Due to its non-trivial effects, this thickness variation angle should be considered as a parameter in FinFET modeling in order to capture a more accurate behavior, instead of only taking the average thickness.
FinFET翅片宽度横向变化的影响
我们已经提出,在阈下操作方面,IOFF、SS和DIBL在响应更高程度的横向厚度不均匀性时得到改善。我们已经表明,线性变化的薄膜厚度的FinFET引入的效果与总厚度的小变化相当。为了解决非均匀性问题,可以采用基于IOFF的总厚度校正因子。由于其非平凡的影响,为了捕获更准确的行为,该厚度变化角应被视为FinFET建模中的一个参数,而不是仅取平均厚度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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