Quantitative solder inspection with computed tomography

Abstract

In this paper we present a quantitative, three-dimensional method to analyze solder characteristics and defect voids using X-ray Computed Tomography (CT). We also present a range of case studies where this methodology has enabled a more precise and time-efficient quality assurance process for printed circuit board suppliers, manufacturers and designers. This methodology also allows a comprehensive, non-destructive inspection and reconstruction of field return or failed samples involving printed circuit boards, hand-soldered assemblies or components, home appliances, and electrical systems.