Developments in 300mm silicon photonics using traditional CMOS fabrication methods and materials

C. Baudot, M. Douix, S. Guerber, S. Crémer, N. Vulliet, J. Planchot, Romuald Blanc, L. Babaud, C. Alonso‐Ramos, D. Benedikovich, D. Pérez-Galacho, S. Messaoudene, Sébastien Kerdilès, P. Acosta-Alba, C. Euvrard-Colnat, E. Cassan, D. Marris-Morini, L. Vivien, F. Boeuf
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引用次数: 16

Abstract

Silicon photonics technological platforms are meant to generate derivative products and concurrently to benefit from the main advantages associated with CMOS platforms namely: high yield, system robustness, product reliability and large volume, low cost production. Nevertheless, a simultaneous innovative approach is to analogously take advantage from state-of-the-art fabrication methods and tools available in CMOS to develop new solutions and propose better performing devices to the platform.
采用传统CMOS制造方法和材料的300mm硅光子学的发展
硅光子学技术平台旨在产生衍生产品,同时受益于CMOS平台的主要优势,即:高产量,系统稳健性,产品可靠性和大批量,低成本生产。然而,同时创新的方法是类似地利用CMOS中可用的最先进的制造方法和工具来开发新的解决方案,并为平台提出性能更好的器件。
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