Integration of Poly Buffered Locos and Gate Processing for Submicron Isolation Technique

W. Juenghng, S. Hillenius, M. Chen, L. Fritzinger
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引用次数: 1

Abstract

Summary form only given. A modified poly buffered LOCOS (PBL) process is described which simplifies processing and provides advantages over conventional PBL and LOCOS processes. The use of a poly buffer between the pad oxide and the nitride layer offers the opportunity of integrating the poly gate deposition and the field isolating process and overcomes the processing difficulties of the conventional PBL while maintaining the advantage of a narrow spacing between active areas (THINOX). The process sequence of the conventional PBL and the integrated PBL (IPBL) process are summarized. >
亚微米隔离技术中Poly缓冲Locos与栅极加工的集成
只提供摘要形式。描述了一种改进的多缓冲LOCOS (PBL)工艺,该工艺简化了加工过程,并提供了优于传统PBL和LOCOS工艺的优点。在衬垫氧化物和氮化层之间使用聚缓冲层,可以将聚栅沉积和场隔离工艺集成在一起,克服了传统PBL的加工困难,同时保持了活性区间距(THINOX)的优势。总结了传统PBL和综合PBL (IPBL)工艺流程。>
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