A new sturcture AlGaN/GaN HEMT

Zhe Cheng, Yun Zhang
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引用次数: 1

Abstract

In several decades, the world has witnessed various dramatic changes since applying of semiconductor. The performance requirements of semiconductor products are continue increasing while the technology is improving. In order to satisfy the requirements, the researches of new material and device structure is necessary. This paper shows a new structure of GaN HEMT. An AlGaN/GaN HEMT consists of AlGaN/GaN Heterojunction, drain electrode, source electrode and gate electrode. Though the researchers have reported a large number of HEMT structures since M. Asif Khan and his colleagues repot the first AlGaN/GaN HEMT in 1993, there is none of the structures, which three electrodes are in different surfaces of device. This paper describes a new structure called different-surface-gate structure, which drain and source electrodes are on the other surface while the gate electrode is on the top surface (AlGaN surface) of the device as normal HEMTs. This paper will establish two models by TCAD simulation software. One is the model of different-surface-gate AlGaN/GaN HEMT and the other one is normal structure AlGaN/GaN HEMT, which is the control model. After building the models, the compare of the models will show the saturation current of the different-surface-gate model is 120% as large as it of the other model.
一种新型的AlGaN/GaN HEMT结构
半导体应用以来的几十年里,世界发生了翻天覆地的变化。在技术不断进步的同时,对半导体产品的性能要求也在不断提高。为了满足这些要求,有必要研究新的材料和器件结构。本文提出了一种新的GaN HEMT结构。AlGaN/GaN HEMT由AlGaN/GaN异质结、漏极、源极和栅电极组成。虽然自1993年M. Asif Khan和他的同事首次报道AlGaN/GaN HEMT以来,研究人员已经报道了大量的HEMT结构,但没有一种结构是三个电极在设备的不同表面上。本文描述了一种新的结构,称为异表面栅极结构,漏极和源极在器件的另一个表面,栅极在器件的上表面(AlGaN表面),与普通hemt一样。本文将利用TCAD仿真软件建立两个模型。一种是不同表面栅极AlGaN/GaN HEMT模型,另一种是正态结构AlGaN/GaN HEMT模型,即控制模型。建立模型后,对模型进行比较,发现不同表面栅极模型的饱和电流比另一种模型大120%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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