Thermal performance evaluation of VLSI packaging

Proceedings. VLSI and Computer Peripherals. COMPEURO 89 Pub Date : 1989-05-08 DOI:10.1109/CMPEUR.1989.93503

Z.J. Staszak, J. Prince, B. R. Simon

引用次数: 1

Abstract

The authors address the problems of thermal performance evaluation of level-1 (chip and carrier) and level-2 (boards/modules and interconnects) integrated-circuit packages. Requirements for thermal modeling and experimental characterization are outlined. Models, simulation tools, and characterization tools and their assessment are discussed.<>

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VLSI封装热性能评估

作者讨论了一级(芯片和载波)和二级(板/模块和互连)集成电路封装的热性能评估问题。概述了热建模和实验表征的要求。讨论了模型、仿真工具和表征工具及其评估

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Proceedings. VLSI and Computer Peripherals. COMPEURO 89

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