Parametric study of EBG bandwidth for grounded square patch arrays by dispersion analysis

M. Kehn, L. Shafai, A. Foroozesh
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引用次数: 1

Abstract

This paper performs a parametric investigation into a couple of factors that influence the bandgap properties of electromagnetic bandgap (EBG) structures. The most common and easily fabricated grounded square-patch array is showcased here, and the two parameters investigated are the patch size relative to the unit cell and the dielectric slab thickness. It will be shown how a numerical search using just these two parameters along with a simple optimization procedure is able to rapidly arrive at a very wide EBG bandwidth of around 30%. Dispersion analyses of the patch array are entailed in conducting the studies. The concepts for the generation of the dispersion diagrams are also presented.
基于色散分析的接地方形贴片阵列EBG带宽参数化研究
本文对影响电磁带隙结构带隙特性的几个因素进行了参数化研究。这里展示了最常见和最容易制作的接地方形贴片阵列,并研究了两个参数:相对于单元格的贴片尺寸和介电板厚度。它将显示如何使用这两个参数的数值搜索以及一个简单的优化程序能够快速到达大约30%的非常宽的EBG带宽。在进行研究时需要对贴片阵列进行色散分析。本文还提出了色散图生成的概念。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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