D. Wakui, Naoki Imai, Y. Nagaura, Hironobu Sato, T. Sekiguchi, S. Konishi, S. Shoji, T. Homma
{"title":"EHD Micro Pump using Pyrolyzed Polymer 3-D Carbon Mesh Electrodes","authors":"D. Wakui, Naoki Imai, Y. Nagaura, Hironobu Sato, T. Sekiguchi, S. Konishi, S. Shoji, T. Homma","doi":"10.1109/MEMSYS.2009.4805428","DOIUrl":null,"url":null,"abstract":"This paper presents the EHD (electro-hydrodynamic) micro pump using 3-D carbon mesh electrodes. The carbon electrodes were fabricated by pyrolysis of SU-8 micro mesh structures [1]. Low temperature SU-8 bonding method under 90°C was developed to realize wafer level carbon structure packaging. The pumping behaviors were evaluated using fluorinert as a sample solution. The maximum pressure and volume flow rate are about 23Pa and 400nL/min under applied voltage of 500V.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"47 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMSYS.2009.4805428","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
This paper presents the EHD (electro-hydrodynamic) micro pump using 3-D carbon mesh electrodes. The carbon electrodes were fabricated by pyrolysis of SU-8 micro mesh structures [1]. Low temperature SU-8 bonding method under 90°C was developed to realize wafer level carbon structure packaging. The pumping behaviors were evaluated using fluorinert as a sample solution. The maximum pressure and volume flow rate are about 23Pa and 400nL/min under applied voltage of 500V.