Self-heating in SOI nano devices

D. Vasileska
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引用次数: 6

Abstract

State of the art 2D and 3D electro-thermal particle-based device simulators have been developed to investigate degradation in the on-current due to self-heating effects in fully-depleted SOI devices and nanowire transistors. For the fully-depleted SOI devices in which we have thin silicon slabs temperature and thickness dependent expression for the thermal conductivity data that agrees perfectly with Asheghi and co-workers experimental data is derived and implemented in the code. Regarding the thermal conductivity of the nanowire transistor, the experimental data of Li Shi and co-workers are used. We find that velocity saturation effect in both fully-depleted SOI and nanowire transistors is the main reason for the observation of smaller degradation due to self-heating effects. For the case of FD SOI devices, we find that crystallographic orientation plays role on the amount of current degradation. For the case of the nanowire transistors, we find that placement of contacts significantly affects the current degradation.
SOI纳米器件的自加热
目前,基于二维和三维电热粒子的器件模拟器已经被开发出来,用于研究在完全耗尽的SOI器件和纳米线晶体管中由于自热效应而导致的导通电流退化。对于完全耗尽的SOI器件,我们有薄硅板,导热系数数据的温度和厚度依赖表达式与Asheghi和同事的实验数据完全一致,并在代码中推导和实现。关于纳米线晶体管的导热系数,采用了李石等人的实验数据。我们发现,在完全耗尽的SOI和纳米线晶体管中,速度饱和效应是观察到由于自热效应而较小的退化的主要原因。对于FD SOI器件,我们发现晶体取向对电流退化量起着重要作用。对于纳米线晶体管,我们发现触点的位置对电流退化有显著影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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